Plenary Speakers

Technology Inflection Points in Logic Semiconductor Technology : What is Next?

  • Fellow, Dong-Won Kim

    Samsung Co., Ltd., Korea

TBA

  • Head of RTC, Myung-Hee Na

    SK Hynix, Korea

1. Nanoscale Thin Film Deposition

TBA

  • Prof. Stacey F. Bent

    Stanford Univ., USA

4. Advanced Lithography

0.33 NA EUV Systems for High-Volume Manufacturing

5. 3D Heterogeneous Package

Chips, Dies, Chiplets and Dielets and Heterogeneous Integration (of course!)

6. Nanoanalysis, Diagnosis and MI

TBA

  • Dr. Tuyen Tran

    INTEL, USA