Invited Speakers
1. Nanoscale Thin Film Deposition
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Optimization of Semiconductor Device Characteristics Using Nano-Scale Thin Film Deposition
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Dr. Hanjin Lim
Samsung Co., Ltd., Korea
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Thin Film Process Engineering for Continued Memory Device Scaling
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Dr. Dongwon Choi
SK Hynix, Korea
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Overview of ALD Precursors for Semiconductor Manufacturing
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Dr. Wonyong Koh
UPChem, Korea
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New ALD Chemistry for Metals and Area Selective Deposition
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Prof. Makku Leskala
Univ. of Helsinki, Finland
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Atomic-Scale Manufacturing Using Selective Atomic Layer Deposition and Etching
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Prof. Adrie Mackus
Eindhoven Univ. of Tech., Netherlands
2. CMP & Cleaning
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Trends of Wet Material for Cleaning/CMP Process and the Future
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Dr. Hyosan Lee
Samsung Co., Ltd., Korea
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Challenges in Chemical Mechanical Planarization for Advanced Memory Devices
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Dr. Hyo-Chol Koo
SK Hynix, Korea
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Hybrid CMP Slurry Supply Using Ionization and Atomization
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Prof. Hae Do Jeong
Pusan Nat’l Univ., Korea
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Development of a Membrane Process for Small Particle Removal in CMP Slurry and Post-CMP Cleaning
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Prof. Taesung Kim
Sungkyunkwan Univ., Korea
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Overall Requirements for Wet Chemical and CMP Materials in Foundry Business
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Dr. Inyu Jung
Samsung Electronics Co., Ltd., Korea
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New Cleaning Solution Concepts for Advanced Technologies - from Chemical Supplier View
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Dr. Andreas Klipp
BASF, Germany
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Challenges in Selective Silicon Nitride Etching for 3D NAND Integration
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Prof. Sangwoo Lim
Yonsei Univ., Korea
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Scavenger with Protonated Phosphite Ion for Incredible Nanoscale ZrO2-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization
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Prof. Jeagun Park
Hanyang Univ., Korea
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Post CMP Cleaning; Its Trend and Challenges
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Prof. Jin Goo Park
Hanyang Univ., Korea
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Oxide Polishing Mechanism of Nanoceria
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Dr. Nomura Satoyuki
Showa Denko, Japan
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Polishing Selectivity Control for Scratch Free Nanoceria Slurry
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Dr. Iwano Tomohiro
Showa Denko, Japan
3. High Functional Etching
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80 nm-Line Etching of Copper Thin Films Using Ethylenediamine/Acetic Acid/Ar Gas Mixture
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Prof. Chee Won Chung
Inha Univ., Korea
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Why you should use Hairpin-Probe and Not Langmuir-Probe for Negative-Ion Density via Laser Photo-Detachment
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Prof. Bert Ellingboe
Dublin City Univ., Ireland
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Reaction Kinetics of Thermal ALE in High Aspect Ratio Hafnium Oxide Structures
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Dr. Andreas Fischer
Lam Research Corp., Korea
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Conductor Etch Process - A Technical Review
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Dr. Yeonghun Han
SK Hynix, Korea
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Alternative Approach for Low Temperature Copper Dry Etching with Large Sized ECR Plasma Source
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Prof. Munpyo Hong
Korea Univ., Korea
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Plasma Diagnostic-Based Semiconductor Process Simulation
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Prof. Yeon-Ho Im
Jeonbuk Nat'l Univ., Korea
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Nanoscale Dry Processes for Controlling Atomic Layer Reactions and Fabrication of High-Aspect-Ratio Features
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Prof. Kenji Ishikawa
Nagoya Univ., Japan
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The Story of Plasma Patterning
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Fellow Kyoungho Jang
TEL, Japan
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The Use of Fluorinated Ethers for Plasma Etching of SiO2
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Prof. Chang-Koo Kim
Ajou Univ., Korea
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Metal-Assisted Chemical Etching as a Sustainable Manufacturing Process for Wafer Scale Uniform Semiconductor Nanostructures
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Prof. Munho Kim
Nanyang Tech. Univ., Singapore
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Prospects of Atomic Layer Process: Past, Present, & Future
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VP. YunSang(YS) Kim
SEMES, Korea
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Independent Effect of Each Plasma Parameter on High Aspect Ratio (HAR) Oxide Etching Process at Low Frequency Bias Power Using ICP System
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Prof. Kwang Ho Kwon
Korea Univ., Korea
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Phase Resolved Plasma Dynamics of RF Capacitively Coupled Plasma Using Particle Trajectory Analysis
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Prof. Hae June Lee
Pusan Nat'l Univ., Korea
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Atomic Layer Modification/Etching of 2-Dimensional MoS2 Semiconductor Material
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Prof. Geun Young Yeom
Sungkyunkwan Univ.,, Korea
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Data-Informed Advanced Plasma Equipment/Process Control Technologies for Etch Process
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Dr. Jung Sik Yoon
KFE, Korea
4. Advanced Lithography
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Challenges and Chances on EUV Lithography
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Dr. Chan Hwang
Samsung Co., Ltd., Korea
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Extension of EUV Lithography Technology for Next Patterning Solutions
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Mr. Sarohan Park
SK Hynix, Korea
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Controlling EUV Resist Stochastics
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Prof. Greg Denbeaux
SUNY Polytechnic Inst., USA
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Lensless EUV metrology for advanced lithography
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Dr. Yasin Ekinci
Paul Scherrer Inst., Switzerland
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EUV Sources and Their Applications
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Dr. Dong Gun Lee
Esol, Korea
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Defect-Free EUV Patterning Using a Dry Deposited and Dry Developed EUV Photoresist System
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VP. Wise Rich
Lam Research, USA
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EUV Under-Layer Development and Challenges
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Mr. Shimizu Sho
Nissan Chemicals, Japan
5. 3D Heterogeneous Package
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3D Package Technology, "The new boundary of Si and Package technology"
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Dr. Daewoo Kim
Samsung Electronics Co., Ltd., Korea
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Heterogeneous Integration in Memory Application and the Contribution of Electronic Packaging Technology
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Dr. Jong Hoon Kim
SK Hynix, Korea
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Tiling Bonding Process, Enabling Technology for Chiplet Integration
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Dr. Kwang-Seong Choi
ETRI, Korea
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3-Dimensional Integration with High Interconnection Density
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Prof. Rino Choi
Inha Univ., Korea
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Heterogeneous 3D Integration Technology for Future Information Systems
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Prof. Mitsumasa Koyanagi
Tohoku Univ., Japan
6. Nanoanalysis, Diagnosis and MI
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SEM Technology for 3D Measurement of High Aspect Ratio Structure
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Dr. Younghoon Sohn
Samsung Co., Ltd., Korea
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Methodologies in Determining Physical Characterization of Semiconductor Process Using In-line Analysis Tools
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Dr. Jae-hyun Kim
SK Hynix, Korea
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Recent Progress in Nanofabrications of T-Gates for InP-HEMTs by Electron Beam Lithography at Fudan University
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Prof. Yifang Chen
Fudan Univ., China
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How to Implement Thin Film Device Characterization to Accelerate Manufacturing R&D – Much Faster, Chipper but More Accurate
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Mr. Joon-Young Choi
SurplusGLOBAL, Korea
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MI: The Key of Semiconductor Processes
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Dr. Byoungho Lee
Hitachi-hightech, Japan
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PI-VM: The Most Efficient Way to Control the Plasma Processes in Mass Production with Data-Driven Plasma Science
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Dr. Seolhye Park
Samsung Display Co., Ltd., Korea
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Precise Spectroscopic Analysis on Ultrathin Oxide Layer and Interfaces for Advanced ICs and Emerging Devices
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Prof. Hyung-Tak Seo
Ajou Univ., Korea
7. Electronic Materials, Devices and Related Technology
Special Topic : Memory Device Roadmap
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Memory Technology 2022 and Beyond
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Dr. Jeongdong Choe
Techlnsights, Canada