Optimization of Semiconductor Device Characteristics Using Nano-Scale Thin Film Deposition

• Dr. Hanjin Lim

  Samsung Co., Ltd., Korea

  Biography

Thin Film Process Engineering for Continued Memory Device Scaling

• Dr. Dongwon Choi

  SK Hynix, Korea

  Biography

Overview of ALD Precursors for Semiconductor Manufacturing

• Dr. Wonyong Koh

  UPChem, Korea

  Biography

New ALD Chemistry for Metals and Area Selective Deposition

• Prof. Makku Leskala

  Univ. of Helsinki, Finland

  Biography

Atomic-Scale Manufacturing Using Selective Atomic Layer Deposition and Etching

• Prof. Adrie Mackus

  Eindhoven Univ. of Tech., Netherlands

  Biography

Trends of Wet Material for Cleaning/CMP Process and the Future

• Dr. Hyosan Lee

  Samsung Co., Ltd., Korea

  Biography

Challenges in Chemical Mechanical Planarization for Advanced Memory Devices

• Dr. Hyo-Chol Koo

  SK Hynix, Korea

  Biography

Hybrid CMP Slurry Supply Using Ionization and Atomization

• Prof. Hae Do Jeong

  Pusan Nat’l Univ., Korea

  Biography

Development of a Membrane Process for Small Particle Removal in CMP Slurry and Post-CMP Cleaning

• Prof. Taesung Kim

  Sungkyunkwan Univ., Korea

  Biography

Overall Requirements for Wet Chemical and CMP Materials in Foundry Business

• Dr. Inyu Jung

  Samsung Electronics Co., Ltd., Korea

  Biography

New Cleaning Solution Concepts for Advanced Technologies - from Chemical Supplier View

• Dr. Andreas Klipp

  BASF, Germany

  Biography

Challenges in Selective Silicon Nitride Etching for 3D NAND Integration

• Prof. Sangwoo Lim

  Yonsei Univ., Korea

  Biography

Scavenger with Protonated Phosphite Ion for Incredible Nanoscale ZrO₂-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization

• Prof. Jeagun Park

  Hanyang Univ., Korea

Post CMP Cleaning; Its Trend and Challenges

• Prof. Jin Goo Park

  Hanyang Univ., Korea

Oxide Polishing Mechanism of Nanoceria

• Dr. Nomura Satoyuki

  Showa Denko, Japan

  Biography

Polishing Selectivity Control for Scratch Free Nanoceria Slurry

• Dr. Iwano Tomohiro

  Showa Denko, Japan

  Biography

80 nm-Line Etching of Copper Thin Films Using Ethylenediamine/Acetic Acid/Ar Gas Mixture

• Prof. Chee Won Chung

  Inha Univ., Korea

  Biography

Why you should use Hairpin-Probe and Not Langmuir-Probe for Negative-Ion Density via Laser Photo-Detachment

• Prof. Bert Ellingboe

  Dublin City Univ., Ireland

  Biography

Reaction Kinetics of Thermal ALE in High Aspect Ratio Hafnium Oxide Structures

• Dr. Andreas Fischer

  Lam Research Corp., Korea

  Biography

Conductor Etch Process - A Technical Review

• Dr. Yeonghun Han

  SK Hynix, Korea

  Biography

Alternative Approach for Low Temperature Copper Dry Etching with Large Sized ECR Plasma Source

• Prof. Munpyo Hong

  Korea Univ., Korea

  Biography

Plasma Diagnostic-Based Semiconductor Process Simulation

• Prof. Yeon-Ho Im

  Jeonbuk Nat'l Univ., Korea

  Biography

Nanoscale Dry Processes for Controlling Atomic Layer Reactions and Fabrication of High-Aspect-Ratio Features

• Prof. Kenji Ishikawa

  Nagoya Univ., Japan

  Biography

The Story of Plasma Patterning

• Fellow Kyoungho Jang

  TEL, Japan

  Biography

The Use of Fluorinated Ethers for Plasma Etching of SiO₂

• Prof. Chang-Koo Kim

  Ajou Univ., Korea

  Biography

Metal-Assisted Chemical Etching as a Sustainable Manufacturing Process for Wafer Scale Uniform Semiconductor Nanostructures

• Prof. Munho Kim

  Nanyang Tech. Univ., Singapore

  Biography

Prospects of Atomic Layer Process: Past, Present, & Future

• VP. YunSang(YS) Kim

  SEMES, Korea

Independent Effect of Each Plasma Parameter on High Aspect Ratio (HAR) Oxide Etching Process at Low Frequency Bias Power Using ICP System

• Prof. Kwang Ho Kwon

  Korea Univ., Korea

Phase Resolved Plasma Dynamics of RF Capacitively Coupled Plasma Using Particle Trajectory Analysis

• Prof. Hae June Lee

  Pusan Nat'l Univ., Korea

  Biography

Atomic Layer Modification/Etching of 2-Dimensional MoS₂ Semiconductor Material

• Prof. Geun Young Yeom

  Sungkyunkwan Univ.,, Korea

Data-Informed Advanced Plasma Equipment/Process Control Technologies for Etch Process

• Dr. Jung Sik Yoon

  KFE, Korea

Challenges and Chances on EUV Lithography

• Dr. Chan Hwang

  Samsung Co., Ltd., Korea

  Biography

Extension of EUV Lithography Technology for Next Patterning Solutions

• Mr. Sarohan Park

  SK Hynix, Korea

  Biography

Controlling EUV Resist Stochastics

• Prof. Greg Denbeaux

  SUNY Polytechnic Inst., USA

  Biography

Lensless EUV metrology for advanced lithography

• Dr. Yasin Ekinci

  Paul Scherrer Inst., Switzerland

  Biography

EUV Sources and Their Applications

• Dr. Dong Gun Lee

  Esol, Korea

  Biography

Defect-Free EUV Patterning Using a Dry Deposited and Dry Developed EUV Photoresist System

• VP. Wise Rich

  Lam Research, USA

  Biography

EUV Under-Layer Development and Challenges

• Mr. Shimizu Sho

  Nissan Chemicals, Japan

  Biography

3D Package Technology, "The new boundary of Si and Package technology"

• Dr. Daewoo Kim

  Samsung Electronics Co., Ltd., Korea

  Biography

Heterogeneous Integration in Memory Application and the Contribution of Electronic Packaging Technology

• Dr. Jong Hoon Kim

  SK Hynix, Korea

  Biography

Tiling Bonding Process, Enabling Technology for Chiplet Integration

• Dr. Kwang-Seong Choi

  ETRI, Korea

  Biography

3-Dimensional Integration with High Interconnection Density

• Prof. Rino Choi

  Inha Univ., Korea

  Biography

Heterogeneous 3D Integration Technology for Future Information Systems

• Prof. Mitsumasa Koyanagi

  Tohoku Univ., Japan

  Biography

SEM Technology for 3D Measurement of High Aspect Ratio Structure

• Dr. Younghoon Sohn

  Samsung Co., Ltd., Korea

  Biography

Methodologies in Determining Physical Characterization of Semiconductor Process Using In-line Analysis Tools

• Dr. Jae-hyun Kim

  SK Hynix, Korea

  Biography

Recent Progress in Nanofabrications of T-Gates for InP-HEMTs by Electron Beam Lithography at Fudan University

• Prof. Yifang Chen

  Fudan Univ., China

  Biography

How to Implement Thin Film Device Characterization to Accelerate Manufacturing R&D – Much Faster, Chipper but More Accurate

• Mr. Joon-Young Choi

  SurplusGLOBAL, Korea

MI: The Key of Semiconductor Processes

• Dr. Byoungho Lee

  Hitachi-hightech, Japan

  Biography

PI-VM: The Most Efficient Way to Control the Plasma Processes in Mass Production with Data-Driven Plasma Science

• Dr. Seolhye Park

  Samsung Display Co., Ltd., Korea

  Biography

Precise Spectroscopic Analysis on Ultrathin Oxide Layer and Interfaces for Advanced ICs and Emerging Devices

• Prof. Hyung-Tak Seo

  Ajou Univ., Korea

  Biography

Magnetic Skyrmion Device

• Prof. Soong Geun Je

  Chonnam Nat'l Univ., Korea

  Biography

Coupled Spin-Charge Transport in Noncentrosymmetric Systems

• Prof. Jung Woo Yoo

  UNIST, Korea

  Biography

Memory Technology 2022 and Beyond

• Dr. Jeongdong Choe

  Techlnsights, Canada

  Biography